| Mfg Part Number: A2H1375 | NSN : 5961-01-222-8467 | NIIN : 012228467 |
| CAGE Code : 21847 | Manufacturer: Fei Microwave Inc | Item Name : Semiconductor Devic |
| FSC : 5961 Semiconductor Devices and Associated Hardware |
Thank you for your interest in the Semiconductor Devic components we have available on After Market Industrials. This particular Fei Microwave Inc item is listed alongside the NSN 5961-01-222-8467 and part number A2H1375 for your reference. With current availability for this product, we encourage you to utilize our Instant RFQ service in order to receive a competitive quote within 15 minutes or less of you submitting a Request For Quote form. At After Market Industrials, we are backed by our rapid lead times and cost savings, allowing all of our customers to meet their operational deadlines. More than that, we thoroughly vet our products prior to shipping.
Take time in looking through our expansive catalogs and you will find that the NSN 5961-01-222-8467 can be found listed under CAGE Code 21847. We also have numerous other NSN parts, all of which are sourced from leading global manufacturers like Fei Microwave Inc. To begin the purchasing process, fill out and submit a quote request that includes all of your part requirements and see why customers continually rely on us as their go-to sourcing solution. For additional questions, call or email us directly; we are on standby for our customers.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5961-01-222-8467 Item Description: Semiconductor Devic | 5961 | 012228467 | 0 | N | A | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | A | 0 | ||||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| A2h1375 | 2 | 1 | C | 9 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ABBH | INCLOSURE MATERIAL | GLASS ALL SEMICONDUCTOR DEVICE DIODE |
| ABHP | OVERALL LENGTH | 0.050 INCHES MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE |
| ADAV | OVERALL DIAMETER | 0.055 INCHES MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE |
| ALAS | INTERNAL CONFIGURATION | JUNCTION CONTACT ALL SEMICONDUCTOR DEVICE DIODE |
| ALBA | ELECTRODE INTERNALLY-ELECTRICALLY CONNECTED TO CASE | COLLECTOR ALL SEMICONDUCTOR DEVICE DIODE |
| ASCQ | INTERNAL JUNCTION CONFIGURATION | PN ALL SEMICONDUCTOR DEVICE DIODE |
| ASDD | COMPONENT FUNCTION RELATIONSHIP | MATCHED |
| ASKA | COMPONENT NAME AND QUANTITY | 2 SEMICONDUCTOR DEVICE DIODE |
| AXGY | MOUNTING METHOD | PRESS FIT ALL SEMICONDUCTOR DEVICE DIODE |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| CTMZ | SEMICONDUCTOR MATERIAL | SILICON ALL SEMICONDUCTOR DEVICE DIODE |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | -10.0 MAXIMUM FORWARD VOLTAGE, DC ALL SEMICONDUCTOR DEVICE DIODE |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 100.00 MILLIAMPERES MAXIMUM FORWARD CURRENT, DC ALL SEMICONDUCTOR DEVICE DIODE |
| CTRD | POWER RATING PER CHARACTERISTIC | 100.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION ALL SEMICONDUCTOR DEVICE DIODE |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 125.0 DEG CELSIUS AMBIENT AIR ALL SEMICONDUCTOR DEVICE DIODE |
| TTQY | TERMINAL TYPE AND QUANTITY | 4 UNINSULATED WIRE LEAD ALL SEMICONDUCTOR DEVICE DIODE |
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